PowerVIA

At next week’s annual VLSI Symposium, Intel will be presenting a pair of highly-anticipated papers about their progress with their upcoming PowerVia chip fabrication technology – the company’s in-development implementation of backside power delivery networks. Along with Intel’s RibbonFET technology for gate-all-around transistors, PowerVia and RibbonFET are slated to serve as Intel’s big one-two punch to the rest of the silicon lithography industry, introducing two major chip technologies together that Intel believes will vault them back into the fab leadership position. Combined, the two technologies are going to be the backbone of Intel’s “angstrom” era fab nodes, which will go into high volume manufacturing next year, making Intel’s progress with the new technologies a subject of great importance both inside and outside of the...